What are Xeon Silver CPUs

Intel Xeon Silver processors, first introduced by Intel in 2017, are designed for entry-level data center, networking and storage needs. The chips are manufactured on an improved 14nm+ process. They deliver essential performance, improved memory speed, low latency and energy efficiency. Companies that require these processors are often involved in tasks such as:

• Data center operations: For companies that manage cloud services, hosting or large databases.
• Network features: For organizations that perform complex network tasks and require a reliable infrastructure.
• Storage solutions: For companies that store large amounts of data and need quick access to that data.

These processors are also suitable for professional workstations that perform heavy tasks such as 3D modeling and video editing. All Silver 4100 series microprocessors feature a mesh interconnect with a tile-based architecture and dual-socket capabilities with up to 12 cores and 24 threads.

Socket-type per generation

Intel Xeon Silver 1st generation: LGA3647
Intel Xeon Silver 2nd generation: LGA3647
Intel Xeon Silver 3rd generation: LGA4189

What is the difference between the generations

The difference between the generations of Intel Xeon Silver processors lies mainly in the performance improvements, such as higher clock speeds, more cores, and improved memory support. Here are some specific differences:

First generation (Skylake-SP, launched 2017): This generation introduced the Xeon Silver line with a focus on affordable performance for data centers. They offered up to 12 cores and supported DDR4-2400 memory.

• Proc: 14 nm proces
• TDP: 70 W, 85 W
• Mem: 768 GiB hexa-channel DDR4-2400 ECC-geheugen.
• I/O: 48 PCIe Gen 3.0-lanes
• ISA: Alles tot AVX-512 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, AVX, FMA3, AVX2, AVX-512-F/CD/BW /DQ/VL)
• Features: Hyper-Threading, Turbo Boost, Speed ​​Shift, vPro, VT-x, TSX, TXT, Volume Management Device (VMD), Mode-based Execute Control (MBE), Key Protection Technology (KPT) and Platform Trust Technology ( PTT).

Second generation (Cascade Lake-SP, launched 2019): Enhancements in this generation include support for Optane DC persistent memory, faster memory speeds (up to DDR4-2933), and built-in AI instruction sets such as DL Boost for accelerated AI inference tasks.

• Proc: 14 nm process
• TDP: 70 W, 85 W, 100 W
• Mem: 1 TiB hexa-channel DDR4-2400 ECC memory
• I/O: 48 PCIe Gen 3.0 lanes
• ISA: Alles tot AVX-512 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, AVX, FMA3, AVX2, AVX-512-F/CD/BW/DQ/VL/VNNI)
• Features: Hyper-Threading, Turbo Boost, Speed Shift, vPro, VT-x, TSX, TXT, Volume Management Device (VMD), Mode-based Execute Control (MBE), Key Protection Technology (KPT), and Platform Trust Technology (PTT).

Third generation (Ice Lake-SP, launched in 2021): This generation brought with it a new microarchitecture that provides significant IPC (instructions per clock cycle) improvement, as well as support for PCIe 4.0 and higher memory speeds (up to DDR4-3200). The third generation also offers an increased number of cores.

• Highest supported turbo frequency 3.4 GHz, base frequency 2.8 GHz
• Number of CPU sockets supported Maximum 2
• Intel Ultra Path Interconnect (Intel UPI) and Intel UPI Speed ​​2 UPI with 10.4 GT/s
• Support for highest memory speed (DDR4) 2667 MT/s
• Highest supported memory capacity per socket 6 TB
• PCI Express Gen 4 (64 lanes per socket)
• Intel Turbo Boost Technology 2.0, Intel HT Technology, Deep Learning Boost with Vector Neural Network Instructions (VNNI), Intel Advanced Vector Extensions 512 (Intel AVX-512) 2 FMA, Support for Intel Optane
• SSDs and Intel SSDs (3D NAND)
  Intel QuickAssist technology is supported in select Intel C620 series chipsets and discrete PCIe cards.

Packaging

NTS ships Xeon Silver CPUs in custom trays that fit 4. These are stackable and provide optimal protection so that the CPU cannot move in the packaging during transport.

41711024 - Tray Intel Xeon Scalable Processors (1x4) Gold/Silver CPU

The trays are also available separately in our webshop. To do this, follow the link in the product number above.

What should be taken into account when purchasing

The CPU has a code next to the clock speed, as shown in the image below:

• Make sure this code matches when using multiple CPUs. Different versions of processors may have minute differences that affect performance. Using the same code from the same product name ensures that the CPUs are identical.

• Before you upgrade your CPU, check the wattage of the power supply, especially when installing a 2nd processor or in combination with a powerful video card. View the power consumption per component in the product specifications. Your power supply must be able to handle the total with some margin.

• Thermal paste is required for installation of Xeon Silver processors. Ask your account manager to add this to the order, or add it in the webshop.

• If you are looking for a CPU upgrade for a server, keep in mind that an extra processor or faster processor may contain more cores and therefore a software license extension may be required, such as Microsoft Server core licenses. More information can be found on the Windows Server Core Calculator site.

• Before installing the Xeon Silver processors, the CPU cooling must be removed. Before replacing, check which format this should be. This depends on the cooling, but this is often a Philips head 2.